HY910 5 g hot conducting paste

HY910 5 g hot conducting paste

The hot conducting adhesive is suitable for use wherever you need to firmly combine different electrical components. High thermal conductivity and high temperature stability. Read more

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2,07 €

Producer: na3D

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Approximation of price, the exact amount is at the end of the shopping cart


It solidifies quickly in the air.

Weight: 5 g


  • Specific gravity: [25°C (770F)]>2.3
  • Heat transfer coefficient: W/m-k> 0.975
  • Thermal impedance: c-in/W <0.246
  • Drying Time: [25°C]: 5~15 minutes
  • Bonding strength: 1.8 MPa
  • Insulation coefficient: 100 Hz / Kvac 5.1 1000 Hz / Kvac 5.0


The thickness of the product used for application should be approximately 0.1 to 0.5 mm. The thinner the better.

Before application, clean the surface with e.g. alcohol.


The curing speed is related to the relative humidity and air temperature, i.e. the higher the temperature, the higher the curing speed and vice versa.

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