HY910 5 g hot conducting paste

HY910 5 g hot conducting paste

The hot conducting adhesive is suitable for use wherever you need to firmly combine different electrical components. High thermal conductivity and high temperature stability. Read more

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2,07 €

Producer: na3D

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Description

It solidifies quickly in the air.

Weight: 5 g

Specifications:

  • Specific gravity: [25°C (770F)]>2.3
  • Heat transfer coefficient: W/m-k> 0.975
  • Thermal impedance: c-in/W <0.246
  • Drying Time: [25°C]: 5~15 minutes
  • Bonding strength: 1.8 MPa
  • Insulation coefficient: 100 Hz / Kvac 5.1 1000 Hz / Kvac 5.0

Recommendation:

The thickness of the product used for application should be approximately 0.1 to 0.5 mm. The thinner the better.

Before application, clean the surface with e.g. alcohol.

Remark:

The curing speed is related to the relative humidity and air temperature, i.e. the higher the temperature, the higher the curing speed and vice versa.

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